Patent Assignment
Reel/Frame 065813/0292
Assignment of Assignor's Interest
Recorded: 2023-12-08
Pages: 6
Assignors
JUNG, DAWOON
Executed: 2023-06-07
BAEK, SEUNGDUK
Executed: 2023-06-07
LEE, DONGHUN
Executed: 2023-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package
Application:
18/533,800 →
Publication:
US 2024/0194648