Patent Assignment
Reel/Frame 065821/0220
Assignment of Assignor's Interest
Recorded: 2023-12-09
Pages: 6
Assignors
IM, WANGYONG
Executed: 2023-09-15
JO, BYOUNGKON
Executed: 2023-09-15
OH, GYESIK
Executed: 2023-09-15
KIM, DUKSUNG
Executed: 2023-09-15
CHOI, JANGSEOK
Executed: 2023-09-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Die-to-Die (D2D) Interconnects