Apparatus and method for die-to-die (D2D) interconnects
An apparatus includes a first die connected to a second die through a die-to-die (D2D) interface. The first die includes a first interconnect configured to provide first lanes communicating with the second die to the D2D interface, the first interconnect includes a first logic circuit configured to indicate a correlation between a number of chiplet dies connected to the first lanes and connected signal pins from among a plurality of signal pins of the connected chiplet dies. The second die includes the number of connected chiplet dies each including a second interconnect configured to provide second lanes to the D2D interface from each of the connected chiplet dies. The second lanes are configured to be set according to a number of the connected signal pins of the connected chiplet dies.
1. An apparatus comprising:
a first die connected to a second die through a die-to-die (D2D) interface, wherein:
the first die includes a first interconnect configured to provide first lanes communicating with the second die to the D2D interface,
the first interconnect includes a first logic circuit configured to indicate a correlation between a number of chiplet dies connected to the first lanes and connected signal pins from among a plurality of signal pins of the connected chiplet dies,
the second die includes the number of connected chiplet dies each including a second interconnect configured to provide second lanes to the D2D interface from each of the connected chiplet dies,
the second interconnect includes a second logic circuit configured to indicate the correlation, and
the second lanes are configured to be set according to a number of the connected signal pins of the connected chiplet dies.
2. The apparatus of claim 1 , wherein each of the first and second logic circuits includes:
a mapping table configured to set a correlation between the number of connected chiplet dies and information and a number of the connected signal pins of each of the connected chiplet dies.
3. The apparatus of claim 2 , wherein the second die includes chiplet dynamic random access memories (DRAMs), and
wherein the connected signal pins of the chiplet DRAMs include command/address (CA) pins and data (DQ) pins.
4. The apparatus of claim 3 , wherein the mapping table includes registers configured to:
set a number of the CA pins and a number of the DQ pins to be relatively small,
set a number of the chiplet DRAMs to be relatively large, and
provide the number of chiplet DRAMs as a high-capacity memory to the D2D interface by setting the number of chiplet DRAMs to be relatively large.
5. The apparatus of claim 4 , wherein operands of a command transmitted to the CA pins are transmitted to the chiplet DRAMs in synchronization with a relatively large number of clock signal edges.
6. The apparatus of claim 3 , wherein the mapping table includes registers configured to:
set a number of the CA pins and a number of the DQ pins to be relatively large,
set a number of the chiplet DRAMs to be relatively small, and
provide a high-speed memory to the D2D interface by using the relatively large number of CA pins.
7. The apparatus of claim 6 , wherein operands of a command transmitted to the CA pins are transmitted to the chiplet DRAMs in synchronization with a relatively small number of clock signal edges.
8. The apparatus of claim 2 , wherein the second die includes chiplet non-volatile memories (NVMs), and
wherein the connected signal pins of the chiplet NVMs include input/output signal (IO) pins.
9. The apparatus of claim 1 , wherein the first lanes include at least one redundant lane.
10. The apparatus of claim 9 , wherein the at least one redundant lane is configured to handle a defective lane from among the first lanes.
11. The apparatus of claim 1 , wherein lanes from among the first lanes not connected to the second lanes in the D2D interface are configured to be used for:
parameter exchange between the first die and the connected chiplet dies,
access for debug/compliance, or
training and management of a link.
12. The apparatus of claim 1 , wherein the D2D interface is configured to support a compute express link (CXL) protocol or a universal chiplet interconnect express (UCIe) protocol.
13. A method of communicating using a die-to-die (D2D) interface, the method comprising:
providing first lanes of a first die connected to a second die to the D2D interface through a first interconnect of the first die;
providing second lanes of the second die to the D2D interface through a second interconnect of the second die;
setting a correlation between a number of chiplet dies of the second die connected to the first lanes and connected signal pins from among a plurality of signal pins of the connected chiplet dies in a logic circuit of each of the first and second interconnects;
setting the second lanes according to a number of the connected signal pins of the connected chiplet dies; and
communicating between the first die and the connected chiplet dies in an interconnected state, via the D2D interface.
14. The method of claim 13 , wherein the setting of the correlation includes:
in each of the first interconnect and the second interconnect, storing the correlation between the number of the connected chiplet dies and information and the number of the connected signal pins in a mapping table of the logic circuit.
15. The method of claim 13 , wherein the providing of the first lanes includes:
providing at least one redundant lane from among the first lanes to the D2D interface, and
handling a defective lane from among the first lanes by using the at least one redundant lane.
16. The method of claim 13 , wherein the providing of the second lanes includes:
performing a switching operation of connecting the connected signal pins from among the plurality of signal pins of the connected chiplet dies to the second lanes.
17. The method of claim 13 , wherein the communicating between the first die and the connected chiplet dies includes:
performing a memory training operation by the first die on a chiplet dynamic random access memory (DRAM) from among the connected chiplet dies.
18. The method of claim 13 , wherein the providing of the first lanes includes:
providing at least one redundant lane not connected to the second lanes from among the first lanes in the D2D interface, and
by using the at least one redundant lane, performing parameter exchange between the first die and the connected chiplet dies, access for debug/compliance, or training and management of a link.
19. An apparatus comprising:
a first die including a host processor; and
a second die connected to the first die through a die-to-die (D2D) interface, and including a die architecture separated from the first die, wherein:
the first die includes a first interconnect configured to provide first lanes to the D2D interface,
the first interconnect includes a first logic circuit configured to indicate a correlation between a number of chiplet dynamic random access memories (DRAMs) connected to the first lanes and command/address (CA) pins and data (DQ) pins from among a plurality of signal pins of the connected chiplet DRAMs,
each of the number of chiplet DRAMs includes a second interconnect configured to provide second lanes to the D2D interface,
the second interconnect includes a second logic circuit configured to indicate the correlation, and
the first die and the number of chiplet DRAMs are configured to communicate with each other in an interconnected state through the D2D interface.
20. The apparatus of claim 19 , wherein each of the first and second logic circuits includes a mapping table configured to store a correlation between the number of the chiplet DRAMs and a number of the CA pins and a number of the DQ pins of each of the connected chiplet DRAMs.