Patent Assignment
Reel/Frame 065857/0442
Assignment of Assignor's Interest
Recorded: 2023-12-13
Pages: 4
Assignors
CHEN, JIAN
Executed: 2021-06-07
JI, SHILIANG
Executed: 2021-06-07
ZHANG, HAIYANG
Executed: 2021-06-07
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
Covered Property
(1)
Semiconductor Structure and Method of Forming Semiconductor Structure