Assignment of Assignor's Interest

Recorded: 2023-12-13 Pages: 4

Assignor

GUO, LING

Executed: 2023-12-05

Assignee

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN

Covered Property (1)

Wafer Evaluation Method, Wafer Production Method and Device Production Method

Application: 18/538,445 →

Publication: US US20240203769A1

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.