Patent Assignment
Reel/Frame 065862/0251
Assignment of Assignor's Interest
Recorded: 2023-12-13
Pages: 6
Assignors
KATKAR, RAJESH
Executed: 2018-04-17
WANG, LIANG
Executed: 2018-03-16
UZOH, CYPRIAN EMEKA
Executed: 2018-04-17
HUANG, SHAOWU
Executed: 2018-06-21
GAO, GUILIAN
Executed: 2018-04-17
MOHAMMED, ILYAS
Executed: 2018-04-18
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Seal for Microelectronic Assembly
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.