IP Library › Assignment 066125/0306
Patent Assignment
Reel/Frame 066125/0306

Change of Name

Recorded: 2023-12-20 Pages: 5
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (4)
Bonded Structures
Application: 17/829,185 →
Publication: US 2022/0367302
Seal for Microelectronic Assembly
Application: 18/463,080 →
Publication: US 2023/0420313
Bonded Structures
Application: 18/545,120 →
Publication: US 2024/0162102
Bonded Structures
Application: 18/545,136 →
Publication: US 2024/0120245
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Dec 13, 2023
From: KATKAR, RAJESH; WANG, LIANG; UZOH, CYPRIAN EMEKA; HUANG, SHAOWU
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065862/0251 →
Assignment of Assignor's Interest Dec 20, 2023
From: KATKAR, RAJESH; WANG, LIANG
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065918/0604 →