IP Library › Assignment 065918/0604
Patent Assignment
Reel/Frame 065918/0604

Assignment of Assignor's Interest

Recorded: 2023-12-20 Pages: 6
Assignors
KATKAR, RAJESH
Executed: 2018-08-16
WANG, LIANG
Executed: 2018-08-30
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (3)
Bonded Structures
Application: 17/829,185 →
Publication: US 2022/0367302
Bonded Structures
Application: 18/545,120 →
Publication: US 2024/0162102
Bonded Structures
Application: 18/545,136 →
Publication: US 2024/0120245
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Dec 20, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066125/0306 →