Patent Assignment
Reel/Frame 065871/0937
Assignment of Assignor's Interest
Recorded: 2023-12-14
Pages: 3
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, JAPAN
Covered Property
(1)
Semiconductor Device, Method for Manufacturing the Semiconductor Device, and Power Conversion Device
Application:
18/566,891 →
Publication:
US 2024/0274708
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.