IP Library › Assignment 065898/0179
Patent Assignment
Reel/Frame 065898/0179

Assignment of Assignor's Interest

Recorded: 2023-12-18 Pages: 5
Assignors
TIEN, HSI-WEN
Executed: 2019-10-01
LIAO, WEI-HAO
Executed: 2019-10-01
DAI, PIN-REN
Executed: 2019-10-01
LU, CHIH WEI
Executed: 2019-10-01
LEE, CHUNG-JU
Executed: 2019-10-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Method and Structure of Cut End with Self-Aligned Double Patterning
Application: 18/543,432 →
Publication: US 2024/0120200
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2023
From: TIEN, HSI-WEN; LIAO, WEI-HAO; DAI, PIN-REN; LU, CHIH WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 065898/0013 →