Patent Assignment
Reel/Frame 065898/0263
Assignment of Assignor's Interest
Recorded: 2023-12-18
Pages: 4
Assignor
NOGUCHI, SHUNSUKE
Executed: 2023-12-11
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
SiC WAFER AND SiC EPITAXIAL WAFER
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.