Patent Assignment
Reel/Frame 065904/0134
Assignment of Assignor's Interest
Recorded: 2023-12-19
Pages: 3
Assignors
CHIEN, HENG-CHIEH
Executed: 2023-12-01
YANG, SHU-JUNG
Executed: 2023-12-01
LO, FENG-HSIANG
Executed: 2023-12-04
CHAO, YU-LIN
Executed: 2023-12-04
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 310401, TAIWAN
Covered Property
(1)
Antenna-In-Package with Heat Dissipation Structure