Assignment of Assignor's Interest

Recorded: 2023-12-19 Pages: 3

Assignors

TOIA, FABRIZIO FAUSTO RENZO

Executed: 2023-10-30

CAPELLI, DANIELE

Executed: 2023-10-30

SCIARRILLO, SAMUELE

Executed: 2023-11-08

Assignee

STMICROELECTRONICS S.R.L.

VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY

Covered Property (1)

Beol Integration Solution Based on Direct Cmp to Improve Intermetal Dielectric Layer

Application: 18/516,501 →

Publication: US 2025/0167041

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.