Patent Assignment
Reel/Frame 065917/0756
Assignment of Assignor's Interest
Recorded: 2023-12-20
Pages: 9
Assignors
LEE, HUNTEAK
Executed: 2021-09-10
KIM, GWANG
Executed: 2021-09-10
YE, JUNHO
Executed: 2021-09-10
CHOI, YOUJOUNG
Executed: 2021-09-10
KIM, MINKYUNG
Executed: 2021-09-10
KIM, NAMGU
Executed: 2021-09-10
LEE, YONGWOO
Executed: 2022-01-12
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.