Patent Assignment
Reel/Frame 065944/0787
Assignment of Assignor's Interest
Recorded: 2023-12-22
Pages: 4
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER
Application:
18/394,568 →
Publication:
US 2024/0297222
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.