Patent Assignment
Reel/Frame 065950/0269
Assignment of Assignor's Interest
Recorded: 2023-12-26
Pages: 3
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device and Semiconductor Device
Application:
18/560,406 →
Publication:
US US20240250025A1
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.