Patent Assignment
Reel/Frame 065952/0247
Assignment of Assignor's Interest
Recorded: 2023-12-26
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1, ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Solid-State Imaging Element, Solid-State Imaging Element Package, and Electronic Equipment