Patent Assignment
Reel/Frame 065954/0323
Assignment of Assignor's Interest
Recorded: 2023-12-26
Pages: 4
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
SiC Wafer having an End Region with Low Concentrations of Metal Impurities and SiC Epitaxial Wafer
Application:
18/396,164 →
Publication:
US 2024/0213329