IP Library Granted Patent US 12,696,509
Granted Patent B2
US 12,696,509 · App. 18/396,164 · Granted Jul 28, 2026

SiC wafer having an end region with low concentrations of metal impurities and SiC epitaxial wafer

Inventors: Yumiko Nakamura (Tokyo, JP); Yuzo Sasaki (Tokyo, JP)
Assignee: Resonac Corporation
H10D62/8325C30B29/36H10P70/15H10P90/128H10P90/129C30B23/025
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Quick Facts
Patent No.
US 12,696,509
App. No.
18/396,164
Filed
Dec 26, 2023
Granted
Jul 28, 2026
Kind
B2
Art Unit
2814
USPC
257/77
Abstract

A SiC wafer according to the present embodiment includes an end region within 5 mm from an outer circumferential end, wherein, in the end region, the concentration of each of Ti, V and Zr is 5.0×10 11 atoms/cm 2 or less, the concentration of each of Cr, Ni, Cu, W, Mo and Mn is 1.0×10 11 atoms/cm 2 or less, and the concentration of each of B, Al and Fe is 5.0×10 12 atoms/cm 2 or less.

Claims (30)

1 . A SiC wafer including an end region within 5 mm from an outer circumferential end,

wherein, in the end region,

the concentration of each of Ti, V and Zr is 5.0×10 11 atoms/cm 2 or less,

the concentration of each of Cr, Ni, Cu, W, Mo and Mn is 1.0×10 11 atoms/cm 2 or less, and

the concentration of each of B, Al and Fe is 5.0×10 12 atoms/cm 2 or less.

2 . The SiC wafer according to claim 1 ,

wherein, in the end region,

the concentration of each of Ti and V is 3.0×10 11 atoms/cm 2 or less,

the concentration of each of Cr and Zr is 5.0×10 10 atoms/cm 2 or less,

the concentration of each of Ni and Cu is 3.0×10 10 atoms/cm 2 or less,

the concentration of B is 3.0×10 12 atoms/cm 2 or less, and

the concentration of each of Al and Fe is 1.0×10 11 atoms/cm 2 or less.

3 . The SiC wafer according to claim 1 , which has a diameter of 149 mm or more.

4 . A SiC epitaxial wafer, comprising:

the SiC wafer according to claim 2 ; and

a SiC epitaxial layer formed on one surface of the SiC wafer.

5 . The SiC wafer according to claim 3 , which has a diameter of 199 mm or more.

6 . A SiC epitaxial wafer, comprising:

the SiC wafer according to claim 3 ; and

a SiC epitaxial layer formed on one surface of the SiC wafer.

7 . A SiC epitaxial wafer, comprising:

the SiC wafer according to claim 5 ; and

a SiC epitaxial layer formed on one surface of the SiC wafer.

8 . The SiC wafer according to claim 1 , which has a notch cut toward the inside of the SiC wafer.

9 . A SiC epitaxial wafer, comprising:

the SiC wafer according to claim 8 ; and

a SiC epitaxial layer formed on one surface of the SiC wafer.

10 . A SiC epitaxial wafer, comprising:

the SiC wafer according to claim 1 ; and

a SiC epitaxial layer formed on one surface of the SiC wafer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2023
From: NAKAMURA, YUMIKO; SASAKI, YUZO
To: RESONAC CORPORATION
Reel/Frame 065954/0323 →
Priority Claims (1)
JP 2022-209847 · Dec 27, 2022 · national
Continuity (1)
Related Publication 20240213329A1 · Jun 27, 2024
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