Patent Assignment
Reel/Frame 065988/0055
Change of Name
Recorded: 2023-12-13
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structures with Integrated Passive Component
Application:
15/426,942 →
Publication:
US 2018/0190583
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 8, 2017
From: DELACRUZ, JAVIER A.; HUANG, SHAOWU; MIRKARIMI, LAURA WILLS
To: ZIPTRONIX, INC.
Reel/Frame 041205/0019 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →