Patent Assignment
Reel/Frame 066026/0937
Assignment of Assignor's Interest
Recorded: 2024-01-05
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Fabricating the Same