Assignment of Assignor's Interest

Recorded: 2024-01-05 Pages: 2

Assignors

NATORI, MICHIKO

Executed: 2023-12-19

NAKAKO, HIDEO

Executed: 2023-12-19

ISHIKAWA, DAI

Executed: 2023-12-19

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Copper Paste for Forming Sintered Copper Pillars and Method for Producing Bonded Body

Application: 18/550,221 →

Publication: US 2024/0181575

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.