IP Library › Assignment 066046/0891
Patent Assignment
Reel/Frame 066046/0891

Assignment of Assignor's Interest

Recorded: 2024-01-08 Pages: 6
Assignors
BALOGLU, BORA
Executed: 2015-12-22
ZWENGER, CURTIS
Executed: 2016-01-05
HUEMOELLER, RON
Executed: 2016-01-04
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (2)
Semiconductor Product with Interlocking Metal-to-Metal Bonds and Method for Manufacturing Thereof
Application: 16/562,640 →
Publication: US 2020/0020654
Semiconductor Product with Interlocking Metal-to-Metal Bonds and Method for Manufacturing Thereof
Application: 17/328,563 →
Publication: US 2021/0280542
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 25, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055729/0001 →
Assignment of Assignor's Interest Jan 30, 2024
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066380/0348 →