Patent Assignment
Reel/Frame 066380/0348
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 44
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12/03, SINGAPORE, 248373, SINGAPORE
Covered Properties
(12)
Electronic Device Package and Fabricating Method Thereof
Embedded Vibration Management System Having an Array of Vibration Absorbing Structures
Electronic Device Package and Fabricating Method Thereof
Method of Manufacturing an Electronic Device Comprising a Conductive Pad on a Protruding-Through Electrode
Method of Forming a Plurality of Electronic Component Packages and Packages Formed Thereby
Application:
16/774,432 →
Publication:
US 2020/0335476
Semiconductor Package and Fabricating Method Thereof
Electronic Device Package and Fabricating Method Thereof
Semiconductor Product with Interlocking Metal-to-Metal Bonds and Method for Manufacturing Thereof
Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
Semiconductor Device and Method of Manufacturing Thereof
Semiconductor Package and Fabricating Method Thereof
Semiconductor Device Using Emc Wafer Support System and Fabricating Method Thereof
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Nov 3, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 058005/0730 →
Assignment of Assignor's Interest
Jan 4, 2024
From: DUNLAP, BRETT ARNOLD
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066024/0589 →
Assignment of Assignor's Interest
Jan 5, 2024
From: KIM, JIN YOUNG; PARK, DOO HYUN; YOON, JU HOON; SEO, SEONG MIN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066032/0339 →
Assignment of Assignor's Interest
Jan 8, 2024
From: HAN, YI SEUL; LEE, TAE YONG; RYU, JI YEON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066048/0923 →
Assignment of Assignor's Interest
Jan 8, 2024
From: ST. AMAND, ROGER; KWEON, YOUNG DO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066049/0100 →
Assignment of Assignor's Interest
Jan 8, 2024
From: BALOGLU, BORA; ZWENGER, CURTIS; HUEMOELLER, RON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066046/0891 →
Assignment of Assignor's Interest
Jan 8, 2024
From: KIM, JIN YOUNG; PARK, NO SUN; KIM, YOON JOO; LEE, SEUNG JAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066221/0088 →
Assignment of Assignor's Interest
Jan 8, 2024
From: KIM, KEUN SOO; KIM, JAE YUN; AHN, BYOUNG JUN; RYU, DONG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066046/0504 →
Assignment of Assignor's Interest
Jan 9, 2024
From: DO, WON CHUL; KO, YONG JAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066069/0938 →
Assignment of Assignor's Interest
Jan 9, 2024
From: BALOGLU, BORA; SHUMWAY, RUSSELL; MANGRUM, MARC; ARCEDERA, ADRIAN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066062/0494 →