Electronic device package and fabricating method thereof
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
1. An electronic device comprising:
a semiconductor die comprising a first die side, a second die side opposite the first die side, and a plurality of lateral die sides extending between the first and second die sides, where the first die side comprises an integrated circuit and a bond pad;
a lateral structure that laterally covers the lateral die sides, where the lateral structure comprises a first dielectric material (DM1) that comprises a first DM1 side, a second DM1 side, and a plurality of lateral DM1 sides extending between the first and second DM1 sides;
a conductive via structure passing through the first dielectric material and comprising a first via end and a second via end;
a first conductor extending over the first die side and over the first DM1 side, where the first conductor is coupled to the bond pad and to the first via end;
a second conductor coupled to the second via end; and
a second dielectric material on the first die side and on the first DM1 side, where:
the second dielectric material comprises a first aperture that extends through the second dielectric material, where the first conductor is coupled to the bond pad through the first aperture;
the second dielectric material comprises a second aperture that extends through the second dielectric material, where the first conductor is coupled to the first via end through the second aperture;
the second dielectric material contacts the first die side and the first DM1 side; and
the second dielectric material is configured to expose an area of the integrated circuit that is free of bond pads.
2. The electronic device of claim 1 , wherein the conductive via structure passes completely through the first dielectric material between the first DM1 side and the second DM1 side.
3. The electronic device of claim 1 , wherein:
the semiconductor die comprises a second bond pad; and
the area of the integrated circuit that is exposed by the second dielectric material is positioned laterally between the bond pad and the second bond pad.
4. An electronic device comprising:
a semiconductor die comprising a first die side, a second die side opposite the first die side, and a plurality of lateral die sides extending between the first and second die sides, where the first die side comprises an integrated circuit and a bond pad;
a lateral structure that laterally covers the lateral die sides, where the lateral structure comprises a first dielectric material (DM1) that comprises a first DM1 side, a second DM1 side, and a plurality of lateral DM1 sides extending between the first and second DM1 sides;
a conductive via structure passing through the first dielectric material and comprising a first via end and a second via end;
a first conductor extending over the first die side and over the first DM1 side, where the first conductor is coupled to the bond pad and to the first via end;
a second conductor coupled to the second via end; and
a second dielectric material on the first die side and on the first DM1 side, where the second dielectric material comprises:
a first aperture that extends through the second dielectric material, where the first conductor is coupled to the bond pad through the first aperture; and
a second aperture that extends through the second dielectric material, where the first conductor is coupled to the first via end through the second aperture,
and wherein:
the second dielectric material contacts the first die side and the first DM1 side;
the integrated circuit comprises a sensor circuit; and
the second dielectric material is configured to expose the integrated circuit to light.
5. The electronic device of claim 1 , wherein the first dielectric material directly contacts the lateral die sides.
6. The electronic device of claim 1 , comprising a third dielectric material on the second DM1 side and comprising a third aperture, where the second conductor is coupled to the second end of the conductive via structure through the third aperture.
7. The electronic device of claim 6 , wherein a portion of the third dielectric material is on the second die side.
8. The electronic device of claim 1 , wherein the first conductor is directly connected to the bond pad and to the first via end.
9. The electronic device of claim 1 , wherein the first dielectric material comprises a molding compound.
10. The electronic device of claim 1 , wherein the second conductor extends over the second die side.
11. An electronic device comprising:
a semiconductor die comprising a first die side, a second die side opposite the first die side, and a plurality of lateral die sides extending between the first and second die sides, where the first die side comprises an integrated circuit and a bond pad;
a lateral structure that laterally covers the lateral die sides, wherein the lateral structure comprises a first dielectric material (DM1) that comprises:
a first DM1 side that is substantially coplanar with the first die side;
a second DM1 side that is substantially coplanar with the second die side; and
a plurality of lateral DM1 sides extending between the first and second DM1 sides;
a conductive via structure passing through the first dielectric material and comprising a first via end and a second via end;
first conductor extending over the first die side and over the first DM1 side, where the first conductor is coupled to the bond pad and to the first via end;
a second conductor coupled to the second via end;
a second dielectric material on the first die side and on the first DM1 side, wherein the second dielectric material comprises:
a first aperture that extends through the second dielectric material, where the first conductor is coupled to the bond pad through the first aperture; and
a second aperture that extends through the second dielectric material, where the first conductor is coupled to the first via end through the second aperture; and
a third dielectric material on the second DM1 side and comprising a third aperture, where the second conductor is coupled to the second via end through the third aperture.
12. The electronic device of claim 11 , wherein:
the second DM1 side comprises a grinded surface;
the second die side comprises a grinded surface; and
the first DM1 side comprises a molded surface.
13. The electronic device of claim 11 , wherein the first dielectric material contacts the conductive via structure.
14. The electronic device of claim 11 , wherein the first dielectric material contacts the lateral die sides.
15. The electronic device of claim 11 , wherein the conductive via structure comprises a copper conductive via that passes completely through the first dielectric material between the first DM1 side and the second DM1 side.
16. The electronic device of claim 11 , wherein the first dielectric material comprises a molding compound.
17. A method of making an electronic device, the method comprising:
providing a semiconductor die comprising a first die side, a second die side opposite the first die side, and a plurality of lateral die sides extending between the first and second die sides, where the first die side comprises an integrated circuit and a bond pad;
laterally covering the lateral die sides with a lateral structure that comprises a first dielectric material (DM1) and a conductive via structure, wherein:
the first dielectric material (DM1) comprises a first DM1 side, a second DM1 side, and a plurality of lateral DM1 sides extending between the first and second DM1 sides; and
the conductive via structure passes through the first dielectric material and comprises a first via end and a second via end;
forming a first conductor extending over the first die side and over the first DM1 side, where the first conductor is coupled to the bond pad and to the first via end;
forming a second conductor coupled to the second via end; and
forming a second dielectric material on the first die side and on the first DM1 side, wherein:
the second dielectric material comprises a first aperture that extends through the second dielectric material, where the first conductor is coupled to the bond pad through the first aperture;
the second dielectric material comprises a second aperture that extends through the second dielectric material, where the first conductor is coupled to the first via end through the second aperture;
the second dielectric material contacts the first die side and the first DM1 side; and
the second dielectric material is configured to expose an area of the integrated circuit that is free of bond pads.
18. The method of claim 17 , wherein:
the first DM1 side is substantially coplanar with the first die side; and
the second DM1 side is substantially coplanar with the second die side.
19. The method of claim 17 , wherein:
the semiconductor die comprises a second bond pad; and
the area of the integrated circuit that is exposed by the second dielectric material is positioned laterally between the bond pad and the second bond pad.
20. The method of claim 17 , wherein the second dielectric material is configured to expose the area of the integrated circuit to light.