IP Library › Assignment 066221/0088
Patent Assignment
Reel/Frame 066221/0088

Assignment of Assignor's Interest

Recorded: 2024-01-08 Pages: 10
Assignors
KIM, JIN YOUNG
Executed: 2013-11-11
PARK, NO SUN
Executed: 2013-11-12
KIM, YOON JOO
Executed: 2013-11-12
LEE, SEUNG JAE
Executed: 2013-11-13
CHA, SE WOONG
Executed: 2013-11-10
KIM, SUNG KYU
Executed: 2013-11-13
YOON, JU HOON
Executed: 2013-11-12
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (3)
Electronic Device Package and Fabricating Method Thereof
Patent: 9,831,282 →
Application: 15/248,687 →
Publication: US 2016/0365379
Electronic Device Package and Fabricating Method Thereof
Application: 16/423,589 →
Publication: US 2019/0393258
Electronic Device Package and Fabricating Method Thereof
Application: 16/907,860 →
Publication: US 2021/0020679
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Jan 30, 2024
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066380/0348 →