IP Library › Assignment 066032/0339
Patent Assignment
Reel/Frame 066032/0339

Assignment of Assignor's Interest

Recorded: 2024-01-05 Pages: 9
Assignors
KIM, JIN YOUNG
Executed: 2013-10-30
PARK, DOO HYUN
Executed: 2013-10-30
YOON, JU HOON
Executed: 2013-11-01
SEO, SEONG MIN
Executed: 2013-11-01
RINNE, GLENN
Executed: 2013-10-31
LEE, CHOON HEUNG
Executed: 2013-10-28
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (2)
Semiconductor Device Using Emc Wafer Support System and Fabricating Method Thereof
Application: 16/545,105 →
Publication: US 2020/0203331
Semiconductor Device Using Emc Wafer Support System and Fabricating Method Thereof
Application: 17/532,601 →
Publication: US 2022/0181314
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055616/0001 →
Assignment of Assignor's Interest Jan 30, 2024
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066380/0348 →