IP Library › Assignment 066046/0504
Patent Assignment
Reel/Frame 066046/0504

Assignment of Assignor's Interest

Recorded: 2024-01-08 Pages: 9
Assignors
KIM, KEUN SOO
Executed: 2015-04-13
KIM, JAE YUN
Executed: 2015-04-17
AHN, BYOUNG JUN
Executed: 2015-05-27
RYU, DONG SOO
Executed: 2015-04-15
KANG, DAE BYOUNG
Executed: 2015-04-09
PARK, CHEL WOO
Executed: 2015-04-15
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (2)
Semiconductor Package and Fabricating Method Thereof
Application: 16/813,368 →
Publication: US 2020/0350241
Semiconductor Package and Fabricating Method Thereof
Application: 17/468,981 →
Publication: US 2022/0130752
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 3, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 058005/0730 →
Assignment of Assignor's Interest Jan 30, 2024
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066380/0348 →