IP Library Assignment 066052/0606
Patent Assignment
Reel/Frame 066052/0606

Assignment of Assignor's Interest

Recorded: 2024-01-08 Pages: 7
Assignors
PARK, DONG JOO
Executed: 2008-12-23
KIM, JIN SEONG
Executed: 2008-12-23
LEE, KI WOOK
Executed: 2008-12-23
KANG, DAE BYOUNG
Executed: 2009-01-02
CHOI, HO
Executed: 2008-12-23
KIM, KWANG HO
Executed: 2008-12-23
KIM, JAE DONG
Executed: 2008-12-23
JUNG, YEON SOO
Executed: 2008-12-20
CHO, SUNG HWAN
Executed: 2008-12-23
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. TECHNOLOGY CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device with Through-Mold Via
Application: 18/406,784 →
Publication: US 2024/0145346
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 8, 2024
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066223/0796 →