Patent Assignment
Reel/Frame 066059/0611
Assignment of Assignor's Interest
Recorded: 2024-01-09
Pages: 10
Assignors
YANG, SHIN-YI
Executed: 2020-06-29
HUANG, HSIN-YEN
Executed: 2020-06-29
LEE, MING-HAN
Executed: 2020-06-29
SHUE, SHAU-LIN
Executed: 2020-06-29
CHAN, YU-CHEN
Executed: 2020-06-29
LU, MENG-PEI
Executed: 2020-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via