Assignment of Assignor's Interest

Recorded: 2024-01-09 Pages: 6

Assignors

CHUNG, SANGGYO

Executed: 2023-12-21

HAN, SEUNGHEE

Executed: 2023-12-21

LEE, SEULGI

Executed: 2023-12-21

LEE, CHANMI

Executed: 2023-12-21

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Method for Manufacturing Semiconductor Device

Application: 18/407,536 →

Publication: US 2024/0297051