Assignment of Assignor's Interest

Recorded: 2024-01-09 Pages: 11

Assignors

KUROKAWA, GOHEI

Executed: 2023-12-20

OHASHI, HARUHISA

Executed: 2023-12-20

INOUE, TAKAHIRO

Executed: 2023-12-18

Assignees

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU,, TOKYO, 105-7325, JAPAN

USHIO DENKI KABUSHIKI KAISHA

1-6-5, MARUNOUCHI, CHIYODA-KU,, TOKYO, 100-8150, JAPAN

Covered Property (1)

Heat Treatment Chamber, Film Forming Apparatus, and Substrate Heating Method

Application: 18/407,627 →

Publication: US 2024/0244717

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.