Assignment of Assignor's Interest

Recorded: 2024-01-09 Pages: 6

Assignors

TU, TUNGWEN

Executed: 2024-01-04

HO, CHITAI

Executed: 2024-01-04

LIN, KEHUA

Executed: 2024-01-04

CHANG, CHIASHUO

Executed: 2024-01-04

Assignee

TYMPHANY HK LIMITED

RM. 1521, 15/F., BLOCK A , HI-TECH INDUSTRIAL CENTRE, 5-21 PAK TIN PAR STREET, TSUEN WAN, N.T., HONG KONG

Covered Property (1)

Headphone Module

Patent: 1,090,482 →

Application: 29/907,823 →