Patent Assignment
Reel/Frame 066109/0032
Assignment of Assignor's Interest
Recorded: 2024-01-12
Pages: 14
Assignors
FUJITA, AKIRA
Executed: 2021-12-15
GOTO, KYOSEI
Executed: 2021-12-07
ASO, HIROKI
Executed: 2021-12-07
SAIKI, DAISUKE
Executed: 2021-12-07
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus
Application:
18/411,210 →
Publication:
US 2024/0153756