Patent Assignment
Reel/Frame 066117/0010
Assignment of Assignor's Interest
Recorded: 2024-01-12
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Packages and Associated Methods with Solder Mask Opening(S) for in-Package Ground and Conformal Coating Contact
Application:
18/409,765 →
Publication:
US 2024/0145405