Patent Assignment
Reel/Frame 066153/0675
Assignment of Assignor's Interest
Recorded: 2024-01-17
Pages: 3
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Metal Contact Structure in Microelectronic Assembly
Application:
18/393,489 →
Publication:
US 2024/0203917
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.