IP Library › Assignment 066342/0502
Patent Assignment
Reel/Frame 066342/0502

Change of Name

Recorded: 2024-01-17 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multi-Metal Contact Structure in Microelectronic Assembly
Application: 18/393,489 →
Publication: US 2024/0203917
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 17, 2024
From: KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066153/0675 →