Patent Assignment
Reel/Frame 066160/0939
Assignment of Assignor's Interest
Recorded: 2024-01-18
Pages: 7
Assignors
CHOI, DONGMIN
Executed: 2023-10-11
KIM, HYO-SUB
Executed: 2023-10-11
SUN, SANGKYU
Executed: 2023-10-12
AHN, JUNHYEOK
Executed: 2023-10-11
CHOI, JAY-BOK
Executed: 2023-10-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same
Application:
18/541,559 →
Publication:
US 2024/0357803