IP Library › Assignment 066167/0703
Patent Assignment
Reel/Frame 066167/0703

Assignment of Assignor's Interest

Recorded: 2024-01-18 Pages: 5
Assignors
WANG, YING
Executed: 2023-11-21
ZHENG, KE
Executed: 2023-11-21
YONG, CHANGBUM
Executed: 2023-11-20
SEE, GUAN HUEI
Executed: 2023-11-29
MEHTA, GAURAV
Executed: 2023-11-20
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Die Stacking with Integrated Thermal Treatment
Application: 63/600,588 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 18, 2024
From: HUNG, RAYMOND
To: APPLIED MATERIALS, INC.
Reel/Frame 066166/0889 →
Assignment of Assignor's Interest Apr 8, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 067032/0689 →