Patent Assignment
Reel/Frame 066172/0691
Assignment of Assignor's Interest
Recorded: 2024-01-18
Pages: 10
Assignors
TAI, ENYONG
Executed: 2020-08-22
TAKIAR, HEM P.
Executed: 2020-08-26
WANG, LI
Executed: 2020-08-23
NG, HONG WAN
Executed: 2020-08-22
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Overlapping Die Stacks for Nand Package Architecture