Patent Assignment
Reel/Frame 066175/0172
Assignment of Assignor's Interest
Recorded: 2024-01-19
Pages: 9
Assignors
SEDDON, MICHAEL J.
Executed: 2020-07-10
CARNEY, FRANCIS J.
Executed: 2020-08-03
CHEW, CHEE HIONG
Executed: 2020-07-10
WANG, SOON WEI
Executed: 2020-07-10
KUROSE, EIJI
Executed: 2020-07-10
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Semiconductor Packages with Die Including Cavities and Related Methods