Patent Assignment
Reel/Frame 066206/0456
Assignment of Assignor's Interest
Recorded: 2024-01-23
Pages: 5
Assignors
ABRAMOV, ANATOLI ANATOLYEVICH
Executed: 2020-09-08
LIU, ANPING
Executed: 2020-09-08
NISHIMOTO, MICHAEL YOSHIYA
Executed: 2020-09-08
WHEDON, WILLIAM ANTHONY
Executed: 2020-09-08
YU, JAE HYUN
Executed: 2020-10-28
Assignee
CORNING INCORPORATED
SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Apparatus and Method for Controlling Substrate Thickness