IP Library Assignment 066208/0059
Patent Assignment
Reel/Frame 066208/0059

Assignment of Assignor's Interest

Recorded: 2023-07-17 Pages: 5
Assignors
SATOH, HIKARU
Executed: 2023-04-11
FUNAHASHI, HAJIME
Executed: 2023-04-05
YUKUTAKE, HAJIME
Executed: 2023-04-19
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property (1)
Heat Conducting Composition and Cured Product Thereof
Application: 18/272,669 →
Publication: US 2024/0101885
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →