Patent Assignment
Reel/Frame 066218/0757
Assignment of Assignor's Interest
Recorded: 2024-01-23
Pages: 6
Assignors
AHN, DUHYOUNG
Executed: 2023-10-16
KANG, MINSEOK
Executed: 2023-10-16
MOON, SUNGWOOK
Executed: 2023-10-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Plurality of Semiconductor Chips in a Stacked Structure
Application:
18/420,210 →
Publication:
US 2024/0258275