IP Library › Assignment 066241/0869
Patent Assignment
Reel/Frame 066241/0869

Assignment of Assignor's Interest

Recorded: 2024-01-25 Pages: 5
Assignors
WANG, YING
Executed: 2024-01-12
ZHENG, KE
Executed: 2024-01-15
YONG, CHANGBUM
Executed: 2024-01-14
SEE, GUAN HUEI
Executed: 2024-01-12
MEHTA, GAURAV
Executed: 2024-01-14
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Die Stacking with Integrated Thermal Treatment
Application: 18/408,820 →
Publication: US 2025/0167167
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 25, 2024
From: HUNG, RAYMOND
To: APPLIED MATERIALS, INC.
Reel/Frame 066241/0775 →
Assignment of Assignor's Interest Apr 8, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 067032/0689 →