Patent Assignment
Reel/Frame 066270/0236
Assignment of Assignor's Interest
Recorded: 2024-01-28
Pages: 3
Assignor
FENG, LI-WEI
Executed: 2024-01-03
Assignee
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device and Method of Forming the Same
Application:
18/424,841 →
Publication:
US 2025/0203845