Patent Assignment
Reel/Frame 066273/0470
Assignment of Assignor's Interest
Recorded: 2024-01-29
Pages: 5
Assignors
PARK, JUNGMIN
Executed: 2023-07-03
LIM, HANJIN
Executed: 2023-07-03
JUNG, HYUNGSUK
Executed: 2023-07-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device
Application:
18/394,644 →
Publication:
US 2024/0213302