Patent Assignment
Reel/Frame 066275/0785
Assignment of Assignor's Interest
Recorded: 2024-01-29
Pages: 6
Assignors
LEE, KYUNGHWAN
Executed: 2023-12-01
LEE, WONSOK
Executed: 2023-12-06
LEE, JUHO
Executed: 2023-12-04
HA, DAEWON
Executed: 2023-12-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device
Application:
18/421,187 →
Publication:
US 2024/0422964