Patent Assignment
Reel/Frame 066297/0358
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same
Application:
18/425,147 →
Publication:
US 2025/0063739