Patent Assignment
Reel/Frame 066321/0513
Assignment of Assignor's Interest
Recorded: 2024-02-01
Pages: 4
Assignors
CHEN, HSIA-WEI
Executed: 2020-12-09
SUNG, FU-TING
Executed: 2020-12-10
LIAO, YU-WEN
Executed: 2020-12-10
CHU, WEN-TING
Executed: 2020-12-10
JIANG, FA-SHEN
Executed: 2020-12-09
YEH, TZU-HSUAN
Executed: 2020-12-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Device